IEEE transactions on components and packaging technologies : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society.
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| Previous Title: | IEEE transactions on components, packaging, and manufacturing technology. Part A. |
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| Corporate Authors: | , |
| Format: | Journal |
| Language: | English |
| Published: |
New York, NY :
Institute of Electrical and Electronics Engineers,
c1999-
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| Subjects: | |
| Online Access: | Click on "Go to IEL", then "Search", then "Journals"; scroll down to: Components and packaging technologies ... http://ieeexplore.ieee.org/lpdocs/epic03/RecentIssues.htm?punumber=6144 http://ieeexplore.ieee.org/servlet/opac?punumber=6144 |
| Published: | Vol. 22, no. 1 (Mar. 1999)- |
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| Item Description: | Title from cover. |
| Physical Description: | v. : ill. ; 28 cm. Beginning 1999 also available by subscription, in PDF format, via the World Wide Web. |
| Publication Frequency: | Quarterly. |
| ISSN: | 1521-3331 1070-9886 |