Fatigue of electronic materials /
Αποθηκεύτηκε σε:
| Συγγραφή απο Οργανισμό/Αρχή: | |
|---|---|
| Άλλοι συγγραφείς: | , |
| Μορφή: | Βιβλίο |
| Γλώσσα: | English |
| Έκδοση: |
Philadelphia, PA :
ASTM,
c1994.
|
| Σειρά: | ASTM special technical publication ;
1153. |
| Θέματα: |
Πίνακας περιεχομένων:
- Creep-Fatigue Damage Analysis of Solder Joints / S. H. Ju, S. Kuskowski, B. I. Sandor and M. E. Plesha
- Creep-Fatigue Interactions in Eutectic Tin-Lead Solder Alloys / Chih-Wei Kuo, Shankar M. L. Sastry and Kenneth L. Jerina
- A Unified Creep-Plasticity Theory for Solder Alloys / David L. McDowell, Matthew P. Miller and Del C. Brooks
- Thermomechanical and Fatigue Behavior of High-Temperature Lead and Lead-Free Solder Joints / Y.-H. Pao, S. Badgley, R. Govila and E. Jih
- A Model for Primary Creep of 63Sn-37Pb Solder / S. A. Schroeder, W. L. Morris, M. R. Mitchell and M. R. James
- Test Methodologies to Perform Valid Accelerated Thermomechanical Fatigue Tests of Solder Joints / Darrel R. Frear, N. Robert Sorensen and John S. Martens
- High-Cycle Fatigue of Kovar / James A. Wasynczuk, W. Dave Hanna, Franklin D. Ross and Thomas A. Freitag
- Thermal Stresses in Cooled Heat-Releasing Elements of Electronic Devices / Anatoliy Parnas.
- Stress and Thermal Analysis of Resistance Temperature Detectors / Dale A. Wilson and Anbazhagan Katherisan.