Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /

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Autor corporatiu: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Manufacturing Engineering Division, International Mechanical Engineering Congress and Exposition
Altres autors: Ume, Charles, Chao, Pin-Yeh
Format: Actes de congresos Llibre
Idioma:English
Publicat: New York : American Society of Mechanical Engineers, c1995.
Col·lecció:EEP (Series) ; vol. 14.
MED (Series) ; v. 3.
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