International Intersociety Electronic Packaging Conference Lahaina, Hawaii, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, Nihon Kikai Gakkai, Hsu, T., Bar-Cohen, A., & Nakayama, W. (1995). Advances in electronic packaging, 1995: Proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii. American Society of Mechanical Engineers.
Παραπομπή σε μορφή Chicago (17η εκδ.)International Intersociety Electronic Packaging Conference Lahaina, Hawaii, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, Nihon Kikai Gakkai, Tai-Ran Hsu, Avram Bar-Cohen, και Wataru Nakayama. Advances in Electronic Packaging, 1995: Proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : Presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii. New York, N.Y: American Society of Mechanical Engineers, 1995.
Παραπομπή σε μορφή MLA (8th εκδ.)International Intersociety Electronic Packaging Conference Lahaina, Hawaii, et al. Advances in Electronic Packaging, 1995: Proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : Presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii. American Society of Mechanical Engineers, 1995.