Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii /
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| 企业作者: | , , |
|---|---|
| 其他作者: | , , |
| 格式: | 会议录 图书 |
| 语言: | English |
| 出版: |
New York, N.Y :
American Society of Mechanical Engineers,
c1995.
|
| 丛编: | EEP (Series) ;
vol. 10. |
| 主题: |