Computer aided design in electronic packaging /

Computer aided design in electronic packaging /

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Bibliographic Details
Corporate Authors: American Society of Mechanical Engineers. Winter Meeting, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Other Authors: Fulton, Robert E., Agonafer, D.
Format: Book
Language:English
Published: New York : American Society of Mechanical Engineers, 1992.
Series:EEP (Series) ; vol. 3.
Subjects:
Electronic packaging > Design > Data processing > Congresses.
Computer-aided design > Congresses.

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