APA (7th ed.) Citation

American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Applied Mechanics Division, American Society of Mechanical Engineers. Winter Meeting, Engel, P. A., Chen, W. T., & Jahsman, W. E. (1991). Manufacturing processes and materials challenges in microelectronic packaging: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991. The Society.

Chicago Style (17th ed.) Citation

American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Applied Mechanics Division, American Society of Mechanical Engineers. Winter Meeting, Peter A. Engel, W. T. Chen, and W. E. Jahsman. Manufacturing Processes and Materials Challenges in Microelectronic Packaging: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991. New York, N.Y.: The Society, 1991.

MLA (8th ed.) Citation

American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, et al. Manufacturing Processes and Materials Challenges in Microelectronic Packaging: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991. The Society, 1991.