Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993 /

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书目详细资料
企业作者: National Heat Transfer Conference Atlanta, Ga., American Society of Mechanical Engineers. Heat Transfer Division
其他作者: Agonafer, D.
格式: 会议录 图书
语言:English
出版: New York, N.Y. : American Society of Mechanical Engineers, c1993.
丛编:HTD (Series) ; v. 255.
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索引号: A3:AE23C0 F06335
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