Computerized thermophysical property packages : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992 /
Enregistré dans:
Collectivités auteurs: | , |
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Autres auteurs: | |
Format: | Livre |
Langue: | English |
Publié: |
New York, N.Y. :
American Society of Mechanical Engineers,
c1992.
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Collection: | HTD (Series) ;
v. 225. |
Sujets: |
CARM 1 Store
Cote: |
A3:AE22D0 F06357 |
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Exemplaire 1 | Disponible Réserver |