Computerized thermophysical property packages : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992 /
Gardado en:
Corporate Authors: | , |
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Outros autores: | |
Formato: | Libro |
Idioma: | English |
Publicado: |
New York, N.Y. :
American Society of Mechanical Engineers,
c1992.
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Series: | HTD (Series) ;
v. 225. |
Subjects: |
CARM 1 Store
Número de Clasificación: |
A3:AE22D0 F06357 |
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Copia 1 | Dispoñible Facer reserva |