Tummala, R. R., & Rymaszewski, E. J. (1997). Microelectronics packaging handbook (2nd ed.). Chapman & Hall.
Chicago Style (17th ed.) CitationTummala, Rao R., and Eugene J. Rymaszewski. Microelectronics Packaging Handbook. 2nd ed. New York: Chapman & Hall, 1997.
MLA (8th ed.) CitationTummala, Rao R., and Eugene J. Rymaszewski. Microelectronics Packaging Handbook. 2nd ed. Chapman & Hall, 1997.
Warning: These citations may not always be 100% accurate.