Microelectronics packaging handbook /

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Bibliographic Details
Other Authors: Tummala, Rao R., 1942-, Rymaszewski, Eugene J.
Format: Book
Language:English
Published: New York : Chapman & Hall, c1997.
Edition:2nd ed.
Series:Programmer's reference library.
Subjects:
Table of Contents:
  • pt. 1. Technology drivers
  • pt. 2. Semiconductor packaging
  • pt. 3. Subsystem packaging.