Thermal stress and strain in microelectronics packaging /

Những quyển sách tương tự

• Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /
  Được phát hành: (1991)
• Microelectronics packaging handbook /
  Được phát hành: (1997)
• Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
  Được phát hành: (1996)
• Electronic packaging materials science III : symposium held November 30-December 4, 1987, Boston, Massachusetts, U.S.A. /
  Được phát hành: (1988)
• Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
  Được phát hành: (1993)