APA引文

Gilleo, K. (2004). Area array packaging processes for BGA, Flip Chip, and CSP. McGraw-Hill.

芝加哥风格引文

Gilleo, Ken. Area Array Packaging Processes for BGA, Flip Chip, and CSP. New York ; London: McGraw-Hill, 2004.

MLA引文

Gilleo, Ken. Area Array Packaging Processes for BGA, Flip Chip, and CSP. McGraw-Hill, 2004.