Dyfyniad APA

Gilleo, K. (2004). Area array packaging processes for BGA, Flip Chip, and CSP. McGraw-Hill.

Dyfyniad Arddull Chicago

Gilleo, Ken. Area Array Packaging Processes for BGA, Flip Chip, and CSP. New York ; London: McGraw-Hill, 2004.

Dyfyniad MLA

Gilleo, Ken. Area Array Packaging Processes for BGA, Flip Chip, and CSP. McGraw-Hill, 2004.

Rhybudd: Mae'n bosib nad yw'r dyfyniadau hyn bob amser yn 100% cywir.