Area array packaging processes for BGA, Flip Chip, and CSP /
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| 其他作者: | |
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| 格式: | 图书 |
| 语言: | English |
| 出版: |
New York ; London :
McGraw-Hill,
c2004.
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| 主题: | |
| 在线阅读: | Contributor biographical information Table of contents Publisher description |
| Item Description: | Formerly CIP. |
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| 实物描述: | x, 260 p. : ill. ; 25 cm. |
| 参考书目: | Includes bibliographical references and index. |
| ISBN: | 0071428291 (acid-free paper) |