rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Area array packaging processes for BGA, Flip Chip, and CSP
  name:
    name part: Gilleo, Ken.
  type of resource: text
  genre: bibliography
  origin info:
    place:
      place term: nyu
    place:
      place term: New York
    place:
      place term: London
    publisher: McGraw-Hill
    date issued: c2004
    date issued: 2004
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: print
    extent: x, 260 p. : ill. ; 25 cm.
  table of contents: Machine derived contents note: Introduction -- Next Generation Flip Chip Materials and Processes -- Concepts -- Cost Analysis -- High-Throughput FC Processing Using No-Flow Analysis -- Wafer-Level FC Processing -- Analysis of Next Generation FC Processes -- Compression Flow Placement Model & Analysis -- Modeling and Analysis of Chip Floating -- Flip Chip Assembly and Underfilling -- Process Overview -- Substrate Design -- Assembly with Capillary Flow Underfill -- Assembly with Fluxing Underfills -- Water-Applied Underfills -- Reliability -- BGA and CSP Rework -- Rework Process Considerations -- Basic Network Setups -- Identification of Process Yield Problems -- Component Reballing Considerations -- Analysis Using X-Ray Inspection -- BGA Assembly Reliability -- BGA and QFP Comparison -- BGA Thermal Cycling -- CBGA Failure Mechanisms -- PBGA Failure Mechanisms -- Shock and Thermal Cycling -- BGA Conclusions for Quality and Reliability Programs -- Die Attach and Rework -- Polymer Basics -- Die-Attach Materials -- Die-Attach Application Methods -- Applications -- Properties -- Reliability -- Rework -- Liquid Encapsulation Equipment and Processes -- Encapsulation Materials -- Encapsulation Methods -- Platform Design and Construction -- Dispensing Head -- Needles -- Pumps -- System Control -- Molding for Area Array Packages -- Molding Materials -- Transfer Molding Equipment -- Molding Processes -- Tooling -- Productivity and Cost -- Reliability -- References -- Contributors and Affiliations.
  note: Ken Gilleo, editor.
  note: Formerly CIP.
  note: Includes bibliographical references and index.
  subject:
    topic: Microelectronic packaging
  subject:
    topic: Multichip modules (Microelectronics)
  classification: TK7874 .A72 2004
  classification: 621.381046
  identifier: 0071428291 (acid-free paper)
  identifier: 2004042860
  identifier: http://www.loc.gov/catdir/bios/mh042/2004042860.html
  identifier: http://www.loc.gov/catdir/toc/mh041/2004042860.html
  identifier: http://www.loc.gov/catdir/description/mh051/2004042860.html
  related item:
    location:
      url: http://www.loc.gov/catdir/toc/mh041/2004042860.html
  related item:
    location:
      url: http://www.loc.gov/catdir/bios/mh042/2004042860.html
  related item:
    location:
      url: http://www.loc.gov/catdir/description/mh051/2004042860.html
  location:
    physical location: CARM
  location:
    physical location: SCAN
  record info:
    record content source: DLC
    record creation date: 120504
    record change date: 20120504120626.0
    record identifier: c000389680
    language of cataloging:
      language term: eng