Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /
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| Main Author: | |
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| Format: | Book |
| Language: | English |
| Published: |
New York ; London :
McGraw-Hill,
c2000.
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| Series: | McGraw-Hill professional engineering
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| Subjects: | |
| Online Access: | Table of contents Publisher description Contributor biographical information |
| Physical Description: | xxii, 585 p. : ill. ; 24 cm. |
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| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 0071351418 (hbk.) |