Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /
Bewaard in:
| Hoofdauteur: | |
|---|---|
| Formaat: | Boek |
| Taal: | English |
| Gepubliceerd in: |
New York ; London :
McGraw-Hill,
c2000.
|
| Reeks: | McGraw-Hill professional engineering
|
| Onderwerpen: | |
| Online toegang: | Table of contents Publisher description Contributor biographical information |
| LEADER | 02530cam a2200373 a 4500 | ||
|---|---|---|---|
| 001 | c000389728 | ||
| 003 | CARM | ||
| 005 | 20120504162221.0 | ||
| 008 | 120504s2000 enka b 001 0 eng d | ||
| 010 | |a 99088307 | ||
| 015 | |a GBA1-127 | ||
| 019 | 1 | |a 21255990 |5 LACONCORD2021 | |
| 020 | |a 0071351418 (hbk.) |c No price | ||
| 035 | |a (OCoLC)43036843 |5 LACONCORD2021 | ||
| 040 | |a DLC |b eng |c DLC |d Uk |d DLC | ||
| 050 | 0 | 0 | |a TK7874 |b .L3168 2000 |
| 082 | 0 | 4 | |a 621.3815 |2 21 |
| 100 | 1 | |a Lau, John H. | |
| 245 | 1 | 0 | |a Low cost flip chip technologies : |b for DCA, WLCSP, and PBGA assemblies / |c John H. Lau. |
| 260 | |a New York ; |a London : |b McGraw-Hill, |c c2000. | ||
| 300 | |a xxii, 585 p. : |b ill. ; |c 24 cm. | ||
| 490 | 0 | |a McGraw-Hill professional engineering | |
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | 0 | |a Machine derived contents note: Chapter 1. Integrated Circuit Packaging Trends. -- Chapter 2. Chip-Level Interconnects: Wire Bonds and Solder Bumps. -- Chapter 3. Lead-Free Solders. -- Chapter 4. High-Density PCB and Substrates. -- Chapter 5. Flip Chip on Board with Solderless Materials. -- Chapter 6. Flip Chip on Board with Conventional Underfills. -- Chapter 7. Flip Chip on Board with No-Flow Underfills. -- Chapter 8. Flip Chip on Board with Imperfect Underfills. -- Chapter 9. Thermal Management of Flip Chip on Board. -- Chapter 10. Wafer-Level Packaging. -- Chapter 11. Solder-Bumped Flip Chip on Micro Via-in-Pad Substrates. -- Chapter 12. PCB Manufacturing, Testing, and Assembly of RIMMs. -- Chapter 13. Wire Bonding Chip (Face-Up) in PBGA Packages. -- Chapter 14. Wire Bonding Chip (Face-Down) in PBGA Packages. -- Chapter 15. Solder-Bumped Flip Chip in PBGA Packages. -- Chapter 16. Failure Analysis of Flip Chip on Low-Cost Substrates. -- About the Authors. |
| 650 | 0 | |a Multichip modules (Microelectronics) |x Design and construction. | |
| 650 | 0 | |a Microelectronic packaging. | |
| 852 | 8 | |b CARM |p 0579359 |f BK | |
| 852 | 8 | |b SCAN |h A3:AG19F0 |i C12776 |p 0579359 |f BK | |
| 856 | 4 | 1 | |3 Table of contents |u http://www.loc.gov/catdir/toc/mh023/99088307.html |
| 856 | 4 | 2 | |3 Publisher description |u http://www.loc.gov/catdir/description/mh023/99088307.html |
| 856 | 4 | 2 | |3 Contributor biographical information |u http://www.loc.gov/catdir/bios/mh041/99088307.html |
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| 952 | f | f | |p Can circulate |a CAVAL |b CAVAL |c CAVAL |d CARM 1 Store |i book |m 0579359 |
| 952 | f | f | |a CAVAL |b CAVAL |c CAVAL |d Unmapped Location |e C12776 |f A3:AG19F0 |h Other scheme |