Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /

Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /

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Bibliographische Detailangaben
1. Verfasser:	Lau, John H.
Format:	Buch
Sprache:	English
Veröffentlicht:	New York ; London : McGraw-Hill, c2000.
Schriftenreihe:	McGraw-Hill professional engineering
Schlagworte:	Multichip modules (Microelectronics) > Design and construction. Microelectronic packaging.
Online Zugang:	Table of contents Publisher description Contributor biographical information

Inhaltsangabe:

Machine derived contents note: Chapter 1. Integrated Circuit Packaging Trends.
Chapter 2. Chip-Level Interconnects: Wire Bonds and Solder Bumps.
Chapter 3. Lead-Free Solders.
Chapter 4. High-Density PCB and Substrates.
Chapter 5. Flip Chip on Board with Solderless Materials.
Chapter 6. Flip Chip on Board with Conventional Underfills.
Chapter 7. Flip Chip on Board with No-Flow Underfills.
Chapter 8. Flip Chip on Board with Imperfect Underfills.
Chapter 9. Thermal Management of Flip Chip on Board.
Chapter 10. Wafer-Level Packaging.
Chapter 11. Solder-Bumped Flip Chip on Micro Via-in-Pad Substrates.
Chapter 12. PCB Manufacturing, Testing, and Assembly of RIMMs.
Chapter 13. Wire Bonding Chip (Face-Up) in PBGA Packages.
Chapter 14. Wire Bonding Chip (Face-Down) in PBGA Packages.
Chapter 15. Solder-Bumped Flip Chip in PBGA Packages.
Chapter 16. Failure Analysis of Flip Chip on Low-Cost Substrates.
About the Authors.