Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /

Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /

محفوظ في:
التفاصيل البيبلوغرافية
المؤلف الرئيسي: Lau, John H.
التنسيق: كتاب
اللغة:English
منشور في: New York ; London : McGraw-Hill, c2000.
سلاسل:McGraw-Hill professional engineering
الموضوعات:
Multichip modules (Microelectronics) > Design and construction.
Microelectronic packaging.
الوصول للمادة أونلاين:Table of contents
Publisher description
Contributor biographical information
جدول المحتويات:
  • Machine derived contents note: Chapter 1. Integrated Circuit Packaging Trends.
  • Chapter 2. Chip-Level Interconnects: Wire Bonds and Solder Bumps.
  • Chapter 3. Lead-Free Solders.
  • Chapter 4. High-Density PCB and Substrates.
  • Chapter 5. Flip Chip on Board with Solderless Materials.
  • Chapter 6. Flip Chip on Board with Conventional Underfills.
  • Chapter 7. Flip Chip on Board with No-Flow Underfills.
  • Chapter 8. Flip Chip on Board with Imperfect Underfills.
  • Chapter 9. Thermal Management of Flip Chip on Board.
  • Chapter 10. Wafer-Level Packaging.
  • Chapter 11. Solder-Bumped Flip Chip on Micro Via-in-Pad Substrates.
  • Chapter 12. PCB Manufacturing, Testing, and Assembly of RIMMs.
  • Chapter 13. Wire Bonding Chip (Face-Up) in PBGA Packages.
  • Chapter 14. Wire Bonding Chip (Face-Down) in PBGA Packages.
  • Chapter 15. Solder-Bumped Flip Chip in PBGA Packages.
  • Chapter 16. Failure Analysis of Flip Chip on Low-Cost Substrates.
  • About the Authors.

مواد مشابهة