Cooling and thermal design of electronic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /

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Korporace: American Society of Mechanical Engineers. Heat Transfer Division, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, International Mechanical Engineering Congress and Exposition
Další autoři: Amon, Cristina H.
Médium: Konferenční příspěvek Kniha
Jazyk:English
Vydáno: New York : American Society of Mechanical Engineers, c1995.
Edice:HTD (Series) ; v. 319.
EEP (Series) ; v. 15.
Témata:

CARM 1 Store

Informace o exemplářích z: CARM 1 Store
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