Cooling and thermal design of electronic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /

Cooling and thermal design of electronic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /

محفوظ في:
التفاصيل البيبلوغرافية
مؤلفون مشاركون: American Society of Mechanical Engineers. Heat Transfer Division, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, International Mechanical Engineering Congress and Exposition
مؤلفون آخرون: Amon, Cristina H.
التنسيق: وقائع المؤتمر كتاب
اللغة:English
منشور في: New York : American Society of Mechanical Engineers, c1995.
سلاسل:HTD (Series) ; v. 319.
EEP (Series) ; v. 15.
الموضوعات:
Electronic systems > Cooling > Congresses.
Electronic apparatus and appliances > Cooling > Congresses.
Electronic apparatus and appliances > Thermal properties > Congresses.

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