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  1. 1
    JTEC panel on electronic manufacturing and packaging in Japan : final report February 1995 /
    Llibre
    per Kelly, Michael J.
    Publicat 1995
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  2. 2
    Polymeric materials for electronics packaging and interconnection /
    Llibre
    Publicat 1989
    Publisher description
    Table of contents only
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  3. 3
    Circuits, interconnections, and packaging for VLSI /
    Llibre
    per Bakoglu, H. B., 1958-
    Publicat 1990
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  4. 4
    Thermal management handbook : for electronic assemblies /
    Llibre
    per Sergent, Jerry E.
    Publicat 1998
    Publisher description
    Table of contents
    Contributor biographical information
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  5. 5
    Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993 /
    Actes de congresos Llibre
    Publicat 1993
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  6. 6
    Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
    Actes de congresos Llibre
    Publicat 1993
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  7. 7
    Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
    Actes de congresos Llibre
    Publicat 1996
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  8. 8
    Computer aided design in electronic packaging /
    Llibre
    Publicat 1992
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  9. 9
    Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
    Actes de congresos Llibre
    Publicat 1996
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  10. 10
    Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii /
    Actes de congresos Llibre
    Publicat 1995
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  11. 11
    Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /
    Llibre
    Publicat 1991
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  12. 12
    The Electronics assembly handbook /
    Llibre
    Publicat 1988
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  13. 13
    The Packaging of power semiconductor devices /
    Llibre
    Publicat 1986
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  14. 14
    Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /
    Actes de congresos Llibre
    Publicat 1995
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  15. 15
    Electronic materials handbook /
    Llibre
    Publicat 1989
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  16. 16
    Handbook of electronic packaging. /
    Llibre
    per Harper, Charles A.
    Publicat 1969
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  17. 17
    Thermal stress and strain in microelectronics packaging /
    Llibre
    Publicat 1993
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  18. 18
    International Symposium on Advanced Packaging Materials : processes, properties and interfaces : proceedings : Chateau Elan, Braselton, Georgia, March 14-17, 1999 /
    Actes de congresos Llibre
    Publicat 1999
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  19. 19
    Heat transfer enhancement in electronics cooling : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /
    Llibre
    Publicat 1991
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  20. 20
    Electronic packaging and production.
    Revista
    Obtenir text complet
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