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  1. 1
    JTEC panel on electronic manufacturing and packaging in Japan : final report February 1995 /
    图书
    由 Kelly, Michael J.
    出版 1995
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  2. 2
    Polymeric materials for electronics packaging and interconnection /
    图书
    出版 1989
    Publisher description
    Table of contents only
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  3. 3
    Circuits, interconnections, and packaging for VLSI /
    图书
    由 Bakoglu, H. B., 1958-
    出版 1990
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  4. 4
    Thermal management handbook : for electronic assemblies /
    图书
    由 Sergent, Jerry E.
    出版 1998
    Publisher description
    Table of contents
    Contributor biographical information
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  5. 5
    Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993 /
    会议录 图书
    出版 1993
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  6. 6
    Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
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    出版 1993
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  7. 7
    Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
    会议录 图书
    出版 1996
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  8. 8
    Computer aided design in electronic packaging /
    图书
    出版 1992
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  9. 9
    Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
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    出版 1996
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  10. 10
    Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii /
    会议录 图书
    出版 1995
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  11. 11
    Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /
    图书
    出版 1991
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  12. 12
    The Electronics assembly handbook /
    图书
    出版 1988
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  13. 13
    The Packaging of power semiconductor devices /
    图书
    出版 1986
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  14. 14
    Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /
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    出版 1995
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  15. 15
    Electronic materials handbook /
    图书
    出版 1989
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  16. 16
    Handbook of electronic packaging. /
    图书
    由 Harper, Charles A.
    出版 1969
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  17. 17
    Thermal stress and strain in microelectronics packaging /
    图书
    出版 1993
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  18. 18
    International Symposium on Advanced Packaging Materials : processes, properties and interfaces : proceedings : Chateau Elan, Braselton, Georgia, March 14-17, 1999 /
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    出版 1999
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  19. 19
    Heat transfer enhancement in electronics cooling : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /
    图书
    出版 1991
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  20. 20
    Electronic packaging and production.
    杂志
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