Numerical simulation of convection in electronic equipment cooling : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, San Francisco, California, December 10-15, 1989 /

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Enti autori: American Society of Mechanical Engineers. Winter Meeting, American Society of Mechanical Engineers. Heat Transfer Division
Altri autori: Ortega, A., Agonafer, D.
Natura: Libro
Lingua:English
Pubblicazione: New York, N.Y. : The Society, c1989.
Serie:HTD (Series) ; vol. 121.
Soggetti:
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110 2 |a American Society of Mechanical Engineers.  |b Winter Meeting  |d (1989 :  |c Chicago, Ill.) 
245 1 0 |a Numerical simulation of convection in electronic equipment cooling :  |b presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, San Francisco, California, December 10-15, 1989 /  |c sponsored by the Heat Transfer Division, ASME ; edited by A. Ortega, D. Agonafer. 
260 |a New York, N.Y. :  |b The Society,  |c c1989. 
300 |a vii, 72 p. :  |b ill. ;  |c 28 cm. 
490 1 |a HTD ;  |v vol. 121 
504 |a Includes bibliographical references. 
650 0 |a Electronic apparatus and appliances  |x Cooling  |x Congresses. 
650 0 |a Heat  |x Convection  |x Congresses. 
700 1 |a Ortega, A. 
700 1 |a Agonafer, D. 
710 2 0 |a American Society of Mechanical Engineers.  |b Heat Transfer Division 
830 0 |a HTD (Series) ;  |v vol. 121. 
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