Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992 /

Tallennettuna:
Bibliografiset tiedot
Yhteisötekijät: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Production Engineering Division, American Society of Mechanical Engineers. Winter Meeting
Muut tekijät: Bennett, T. J. (Timothy J.), Lee, Yung-Cheng
Aineistotyyppi: Kirja
Kieli:English
Julkaistu: New York : The Society, c1992.
Sarja:PED (Series) ; vol. 60.
EEP (Series) ; vol. 2.
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