Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992 /

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Bibliographic Details
Corporate Authors: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Production Engineering Division, American Society of Mechanical Engineers. Winter Meeting
Other Authors: Bennett, T. J. (Timothy J.), Lee, Yung-Cheng
Format: Book
Language:English
Published: New York : The Society, c1992.
Series:PED (Series) ; vol. 60.
EEP (Series) ; vol. 2.
Subjects:
Description
Physical Description:v, 211 p. : ill. ; 28 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0791811123