Manufacturing aspects in electronic packaging 1993 : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 /

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Detalles Bibliográficos
Autores Corporativos: American Society of Mechanical Engineers. Winter Meeting, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Production Engineering Division
Otros Autores: Lee, Yung-Cheng, Chen, William T., Yih, Y. (Yuehwern)
Formato: Libro
Lenguaje:English
Publicado: New York : American Society of Mechanical Engineers, c1993.
Colección:PED (Series) ; vol. 65.
EEP (Series) ; vol. 5.
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