Manufacturing aspects in electronic packaging 1993 : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 /

Manufacturing aspects in electronic packaging 1993 : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 /

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Bibliographic Details
Corporate Authors: American Society of Mechanical Engineers. Winter Meeting, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Production Engineering Division
Other Authors: Lee, Yung-Cheng, Chen, William T., Yih, Y. (Yuehwern)
Format: Book
Language:English
Published: New York : American Society of Mechanical Engineers, c1993.
Series:PED (Series) ; vol. 65.
EEP (Series) ; vol. 5.
Subjects:
Electronic packaging > Congresses.
Manufacturing processes > Congresses.
Production management > Congresses.
Description
Physical Description:iv, 125 p. : ill. ; 28 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0791810321

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