CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /

CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /

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Bibliographic Details
Corporate Author: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Other Authors: Fulton, Robert E., Agonafer, D.
Format: Book
Language:English
Published: New York : American Society of Mechanical Engineers, 1994.
Series:EEP (Series) ; vol. 9.
Subjects:
Computer-aided engineering > Congresses.
Heat sinks (Electronics) > Congresses.
Heat > Transmission > Data processing > Congresses.
Electronic packaging > Design > Data processing > Congresses.
Electronic apparatus and appliances > Temperature control > Congresses.

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