Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 /

Shranjeno v:
Bibliografske podrobnosti
Corporate Authors: American Society of Mechanical Engineers. Winter Meeting, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Drugi avtorji: Pecht, Michael, Nguyen, Luu T.
Format: Knjiga
Jezik:English
Izdano: New York : American Society of Mechanical Engineers, c1993.
Serija:EEP (Series) ; vol. 6.
Teme:
Opis
Fizični opis:v, 131 p. : ill. ; 28 cm.
Bibliografija:Includes bibliographical references and index.
ISBN:0791810356