Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 /

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Dettagli Bibliografici
Enti autori: American Society of Mechanical Engineers. Winter Meeting, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Altri autori: Pecht, Michael, Nguyen, Luu T.
Natura: Libro
Lingua:English
Pubblicazione: New York : American Society of Mechanical Engineers, c1993.
Serie:EEP (Series) ; vol. 6.
Soggetti:
Descrizione
Descrizione fisica:v, 131 p. : ill. ; 28 cm.
Bibliografia:Includes bibliographical references and index.
ISBN:0791810356