Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /
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| Corporate Authors: | , , |
|---|---|
| Other Authors: | , |
| Format: | Conference Proceeding Book |
| Language: | English |
| Published: |
New York :
American Society of Mechanical Engineers,
c1995.
|
| Series: | EEP (Series) ;
vol. 14. MED (Series) ; v. 3. |
| Subjects: |
CARM 1 Store
| Call Number: |
A1:AR33C0 F05117 |
|---|---|
| Copy 1 | Available Place a Hold |