HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /
Kaydedildi:
Yazar: | |
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Müşterek Yazar: | |
Materyal Türü: | Kitap |
Dil: | English |
Baskı/Yayın Bilgisi: |
Gaithersburg, MD : Washington, DC :
U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; For sale by the Supt. of Docs., U.S. G.P.O.,
1995.
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Seri Bilgileri: | NIST special publication ;
400-96. Semiconductor measurement technology. |
Konular: |
Diğer Bilgileri: | "August 1995." |
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Fiziksel Özellikler: | vi, 87 p. ; 28 cm. |
Bibliyografya: | Includes bibliographical references (p. 47-49) |