HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /

में बचाया:
ग्रंथसूची विवरण
मुख्य लेखक: Albers, John
निगमित लेखक: National Institute of Standards and Technology (U.S.)
स्वरूप: पुस्तक
भाषा:English
प्रकाशित: Gaithersburg, MD : Washington, DC : U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; For sale by the Supt. of Docs., U.S. G.P.O., 1995.
श्रृंखला:NIST special publication ; 400-96.
Semiconductor measurement technology.
विषय:
विवरण
वस्तु वर्णन:"August 1995."
भौतिक वर्णन:vi, 87 p. ; 28 cm.
ग्रन्थसूची:Includes bibliographical references (p. 47-49)