HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /
में बचाया:
| मुख्य लेखक: | |
|---|---|
| निगमित लेखक: | |
| स्वरूप: | पुस्तक |
| भाषा: | English |
| प्रकाशित: |
Gaithersburg, MD : Washington, DC :
U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; For sale by the Supt. of Docs., U.S. G.P.O.,
1995.
|
| श्रृंखला: | NIST special publication ;
400-96. Semiconductor measurement technology. |
| विषय: |
| वस्तु वर्णन: | "August 1995." |
|---|---|
| भौतिक वर्णन: | vi, 87 p. ; 28 cm. |
| ग्रन्थसूची: | Includes bibliographical references (p. 47-49) |