HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /

HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /

Na minha lista:
Detalhes bibliográficos
Autor principal: Albers, John
Autor Corporativo: National Institute of Standards and Technology (U.S.)
Formato: Livro
Idioma:English
Publicado em: Gaithersburg, MD : Washington, DC : U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; For sale by the Supt. of Docs., U.S. G.P.O., 1995.
coleção:NIST special publication ; 400-96.
Semiconductor measurement technology.
Assuntos:
Semiconductors > Thermal properties.
Thermal analysis > Computer programs.
Fourier analysis > Data processing.
Descrição
Descrição do item:"August 1995."
Descrição Física:vi, 87 p. ; 28 cm.
Bibliografia:Includes bibliographical references (p. 47-49)

Registros relacionados