HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /
Shranjeno v:
| Glavni avtor: | |
|---|---|
| Korporativna značnica: | |
| Format: | Knjiga |
| Jezik: | English |
| Izdano: |
Gaithersburg, MD : Washington, DC :
U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; For sale by the Supt. of Docs., U.S. G.P.O.,
1995.
|
| Serija: | NIST special publication ;
400-96. Semiconductor measurement technology. |
| Teme: |
| Opis knjige/članka: | "August 1995." |
|---|---|
| Fizični opis: | vi, 87 p. ; 28 cm. |
| Bibliografija: | Includes bibliographical references (p. 47-49) |