HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /

HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /

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书目详细资料
主要作者: Albers, John
企业作者: National Institute of Standards and Technology (U.S.)
格式: 图书
语言:English
出版: Gaithersburg, MD : Washington, DC : U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; For sale by the Supt. of Docs., U.S. G.P.O., 1995.
丛编:NIST special publication ; 400-96.
Semiconductor measurement technology.
主题:
Semiconductors > Thermal properties.
Thermal analysis > Computer programs.
Fourier analysis > Data processing.
实物特征
Item Description:"August 1995."
实物描述:vi, 87 p. ; 28 cm.
参考书目:Includes bibliographical references (p. 47-49)

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