HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /
Uloženo v:
| Hlavní autor: | |
|---|---|
| Korporativní autor: | |
| Médium: | Kniha |
| Jazyk: | English |
| Vydáno: |
Gaithersburg, MD : Washington, DC :
U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; For sale by the Supt. of Docs., U.S. G.P.O.,
1995.
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| Edice: | NIST special publication ;
400-96. Semiconductor measurement technology. |
| Témata: |
CARM 1 Store
| Signatura: |
A3:AE21D0 F06324 |
|---|---|
| Jednotka 1 | Dostupné Požadavek |