HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /

HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /

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Bibliographische Detailangaben
1. Verfasser: Albers, John
Körperschaft: National Institute of Standards and Technology (U.S.)
Format: Buch
Sprache:English
Veröffentlicht: Gaithersburg, MD : Washington, DC : U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; For sale by the Supt. of Docs., U.S. G.P.O., 1995.
Schriftenreihe:NIST special publication ; 400-96.
Semiconductor measurement technology.
Schlagworte:
Semiconductors > Thermal properties.
Thermal analysis > Computer programs.
Fourier analysis > Data processing.

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