HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /
Enregistré dans:
| Auteur principal: | |
|---|---|
| Collectivité auteur: | |
| Format: | Livre |
| Langue: | English |
| Publié: |
Gaithersburg, MD : Washington, DC :
U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; For sale by the Supt. of Docs., U.S. G.P.O.,
1995.
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| Collection: | NIST special publication ;
400-96. Semiconductor measurement technology. |
| Sujets: |
CARM 1 Store
| Cote: |
A3:AE21D0 F06324 |
|---|---|
| Exemplaire 1 | Disponible Réserver |