HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /
Na minha lista:
Autor principal: | |
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Autor Corporativo: | |
Formato: | Livro |
Idioma: | English |
Publicado em: |
Gaithersburg, MD : Washington, DC :
U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; For sale by the Supt. of Docs., U.S. G.P.O.,
1995.
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Colecção: | NIST special publication ;
400-96. Semiconductor measurement technology. |
Assuntos: |
CARM 1 Store
Área/Cota: |
A3:AE21D0 F06324 |
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Cód. Barras: 1 | Disponível Localização |