Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993 /
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| Corporate Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Conference Proceeding Book |
| Language: | English |
| Published: |
New York, N.Y. :
American Society of Mechanical Engineers,
c1993.
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| Series: | HTD (Series) ;
v. 255. |
| Subjects: |
CARM 1 Store
| Call Number: |
A3:AE23C0 F06335 |
|---|---|
| Copy 1 | Available Place a Hold |