Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
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| Corporate Authors: | , |
|---|---|
| Other Authors: | , |
| Format: | Conference Proceeding Book |
| Language: | English |
| Published: |
New York, N.Y. :
American Society of Mechanical Engineers,
c1996.
|
| Series: | EEP (Series) ;
vol. 17. |
| Subjects: |
CARM 1 Store
| Call Number: |
A3:AE23C0 F06335 |
|---|---|
| Copy 1 | Available Place a Hold |