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|
|
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| LEADER |
01635cam a2200349 a 4500 |
| 001 |
c000291613 |
| 003 |
CARM |
| 005 |
20090506153244.0 |
| 008 |
971127s1996 nyua b 101 0 eng c |
| 010 |
|
|
|a 96078690
|
| 019 |
1 |
|
|a 13550561
|5 LACONCORD2021
|
| 020 |
|
|
|a 079181548X
|
| 035 |
|
|
|a (OCoLC)36216449
|5 LACONCORD2021
|
| 040 |
|
|
|a LC
|b eng
|c LC
|d LC
|
| 042 |
|
|
|a pcc
|
| 050 |
0 |
0 |
|a TK7870.15
|b .S45 1996
|
| 082 |
0 |
0 |
|a 621.381/046
|2 21
|
| 245 |
0 |
0 |
|a Sensing, modeling, and simulation in emerging electronic packaging :
|b presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
|c sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Chao-pin Yeh, Charles Ume.
|
| 260 |
|
|
|a New York, N.Y. :
|b American Society of Mechanical Engineers,
|c c1996.
|
| 300 |
|
|
|a v, 125 p. :
|b ill. ;
|c 28 cm.
|
| 490 |
1 |
|
|a EEP ;
|v vol. 17
|
| 504 |
|
|
|a Includes bibliographical references and index.
|
| 650 |
|
0 |
|a Electronic packaging
|v Congresses.
|
| 650 |
|
0 |
|a Multichip modules (Microelectronics)
|v Congresses.
|
| 700 |
1 |
|
|a Ume, Charles.
|
| 700 |
1 |
|
|a Yeh, Chao-pin.
|
| 710 |
2 |
|
|a American Society of Mechanical Engineers.
|b Electrical and Electronic Packaging Division.
|
| 711 |
2 |
|
|a International Mechanical Engineering Congress and Exposition
|d (1996 :
|c Atlanta, Ga.)
|
| 830 |
|
0 |
|a EEP (Series) ;
|v vol. 17.
|
| 852 |
8 |
|
|b CARM
|h A3:AE23C0
|i F06335
|p 0528041
|f BK
|
| 999 |
f |
f |
|i aaa0df62-2514-55aa-a208-d96c8e343579
|s 29a39779-af5b-5f53-a821-3dd37269e372
|
| 952 |
f |
f |
|p Can circulate
|a CAVAL
|b CAVAL
|c CAVAL
|d CARM 1 Store
|e F06335
|f A3:AE23C0
|h Other scheme
|i book
|m 0528041
|