Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
Gardado en:
| Corporate Authors: | , |
|---|---|
| Outros autores: | , |
| Formato: | Conference Proceeding Libro |
| Idioma: | English |
| Publicado: |
New York, N.Y. :
American Society of Mechanical Engineers,
c1996.
|
| Series: | EEP (Series) ;
vol. 17. |
| Subjects: |
CARM 1 Store
| Número de Clasificación: |
A3:AE23C0 F06335 |
|---|---|
| Copia 1 | Dispoñible Facer reserva |