Handbook of multilevel metallization for integrated circuits : materials, technology, and applications /

Handbook of multilevel metallization for integrated circuits : materials, technology, and applications /

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Bibliographic Details
Other Authors: Wilson, Syd R., Tracy, Clarence J., Freeman, John L.
Format: Book
Language:English
Published: Park Ridge, N.J., U.S.A. : Noyes, c1993.
Series:Materials science and process technology series
Subjects:
Integrated circuits > Design and construction.
Metallizing.
Online Access:Publisher description
LEADER 02771cam a2200409 a 4500
001 c000388336
003 CARM
005 20120116104613.0
008 120116s1993 njua bf 001 0 eng d
010 |a 93026689 
019 1 |a 10287575  |z 24749296  |5 LACONCORD2021 
020 |a 1591243645 (electronic bk.) 
020 |a 0815513402 (hbk.) 
035 |a (OCoLC)28422959  |5 LACONCORD2021 
040 |a DLC  |b eng  |c DLC  |d DLC  |d TOC 
050 0 |a TK7874  |b .H3493 1993 
050 0 0 |a TK7874  |b .H3493 1993 
050 1 4 |a TK7874  |b .H3493 1993eb 
082 0 4 |a 621.3815  |2 20 
245 0 0 |a Handbook of multilevel metallization for integrated circuits :  |b materials, technology, and applications /  |c edited by Syd R. Wilson and Clarence J. Tracy, John L. Freeman, Jr. 
260 |a Park Ridge, N.J., U.S.A. :  |b Noyes,  |c c1993. 
300 |a xxiii, 887 p. :  |b ill. ;  |c 25 cm. 
490 1 |a Materials science and process technology series 
504 |a Includes bibliographical references and index. 
505 2 |a 1. Introduction / Syd R. Wilson, Clarence J. Tracy and John L. Freeman, Jr. -- 2. Silicides and Contacts for ULSI / George E. Georgiou -- 3. Aluminum Based Multilevel Metallizations in VLSI/ULSICs / K. Ramkumar, Sumanta K. Ghosh and Arjun N. Saxena -- 4. Inorganic Dielectrics / Chiu H. Ting -- 5. Organic Dielectrics in Multilevel Metallization of Integrated Circuits / Krishna Seshan, Dominic J. Schepis and Laura B. Rothman -- 6. Planarization Techniques / Jeff Olsen and Farhad Moghadam -- 7. Lithography and Etch Issues for a Multilevel Metallization System / Gregory W. Grynkewich and John N. Helbert -- 8. Electro- and Stress-Migration in MLM Interconnect Structures / Michael L. Dreyer and Paul S. Ho -- 9. Multilevel Metallization Test Vehicle / Syd R. Wilson, Charles J. Varker and John L. Freeman, Jr. -- 10. Manufacturing and Analytic Methods / Thomas Seidel -- 11. Characterization Techniques for VLSI Multilevel Metallization / Simon Thomas. 
505 8 |a 12. Electronic Packaging and Its Influences On Integrated Circuit Design and Processing / Harry K. Charles, Jr. and G. Donald Wagner -- 13. Future Interconnect Systems / S. Simon Wong. 
530 |a Also available online via the World Wide Web, by subscription to Knovel. 
650 0 |a Integrated circuits  |x Design and construction. 
650 0 |a Metallizing. 
700 1 |a Wilson, Syd R. 
700 1 |a Tracy, Clarence J. 
700 1 |a Freeman, John L. 
852 8 |b CARM  |p 0577811  |f BK 
830 0 |a Materials science and process technology series 
856 4 2 |3 Publisher description  |u http://www.loc.gov/catdir/description/wap041/93026689.html 
999 f f |i 08770bb5-816e-51f0-ad35-51ad5b6ce75e  |s f50b5aa5-e69b-5666-9502-dad2e188364b 
952 f f |p Can circulate  |a CAVAL  |b CAVAL  |c CAVAL  |d CARM 1 Store  |i book  |m 0577811 

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