Handbook of multilevel metallization for integrated circuits : materials, technology, and applications /
Wedi'i Gadw mewn:
| Awduron Eraill: | , , |
|---|---|
| Fformat: | Llyfr |
| Iaith: | English |
| Cyhoeddwyd: |
Park Ridge, N.J., U.S.A. :
Noyes,
c1993.
|
| Cyfres: | Materials science and process technology series
|
| Pynciau: | |
| Mynediad Ar-lein: | Publisher description |
Tabl Cynhwysion:
- 1. Introduction / Syd R. Wilson, Clarence J. Tracy and John L. Freeman, Jr.
- 2. Silicides and Contacts for ULSI / George E. Georgiou
- 3. Aluminum Based Multilevel Metallizations in VLSI/ULSICs / K. Ramkumar, Sumanta K. Ghosh and Arjun N. Saxena
- 4. Inorganic Dielectrics / Chiu H. Ting
- 5. Organic Dielectrics in Multilevel Metallization of Integrated Circuits / Krishna Seshan, Dominic J. Schepis and Laura B. Rothman
- 6. Planarization Techniques / Jeff Olsen and Farhad Moghadam
- 7. Lithography and Etch Issues for a Multilevel Metallization System / Gregory W. Grynkewich and John N. Helbert
- 8. Electro- and Stress-Migration in MLM Interconnect Structures / Michael L. Dreyer and Paul S. Ho
- 9. Multilevel Metallization Test Vehicle / Syd R. Wilson, Charles J. Varker and John L. Freeman, Jr.
- 10. Manufacturing and Analytic Methods / Thomas Seidel
- 11. Characterization Techniques for VLSI Multilevel Metallization / Simon Thomas.
- 12. Electronic Packaging and Its Influences On Integrated Circuit Design and Processing / Harry K. Charles, Jr. and G. Donald Wagner
- 13. Future Interconnect Systems / S. Simon Wong.