HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /
Wedi'i Gadw mewn:
| Prif Awdur: | |
|---|---|
| Awdur Corfforaethol: | |
| Fformat: | Llyfr |
| Iaith: | English |
| Cyhoeddwyd: |
Gaithersburg, MD : Washington, DC :
U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; For sale by the Supt. of Docs., U.S. G.P.O.,
1995.
|
| Cyfres: | NIST special publication ;
400-96. Semiconductor measurement technology. |
| Pynciau: |
CARM 1 Store
| Rhif Galw: |
A3:AE21D0 F06324 |
|---|---|
| Copi 1 | Ar gael Gwneud Cais |