HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /
Saved in:
| 主要作者: | |
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| 企业作者: | |
| 格式: | 图书 |
| 语言: | English |
| 出版: |
Gaithersburg, MD : Washington, DC :
U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; For sale by the Supt. of Docs., U.S. G.P.O.,
1995.
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| 丛编: | NIST special publication ;
400-96. Semiconductor measurement technology. |
| 主题: |
CARM 1 Store
| 索引号: |
A3:AE21D0 F06324 |
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| 复印件 1 | 可用 预订 |